Fine pitch placement up to 12 mil
Component ranges from 01005 BGA and uBGA, CSP up to 55 mm sq
±25 micron placement accuracy with 3-Sigma capability
Board size: 534 x 610 mm
Board types: Rigid, Flex, Ceramic Substrate
SMT assembly in a class and dust-free zone
N2-enabled reflow soldering machines to produce high reliable solder joints
End-to-end traceability systems
Through-hole component assembly and dedicated product assembly line for volume builds
End-to-end traceability systems
Screen printers – MPM Accuflex
Placement machines – Fuji, Universal, Yamaha
SPI Machines – Cyber Optics, KY 3020T
Reflow ovens – Electrovert, Heller
AOI – Cyber Optics, Agilent, Viscom, KY, Vitrox
Router/depanelizer (manual & automatic systems)
Traceability software – Fuji Trax
Conformal coating and UV check chambers
BGA repair station
In Circuit Testers – Kyoritsu, Tescon
Manufacturing Defect Analyzers – TRI
3D X-ray Inspection Systems
Customized automated test equipment
Environment & thermal shock chamber
Coordinate measuring machine – Mitutoyo
Profile projector (125Khz LCR meter)
Solder paste viscosity meter & height measurement
Video measuring machine
Vibration & bump tester
